Micro-device with a cavity

ABSTRACT

A micro-device includes a substrate with a cavity. The cavity is covered with a porous layer that is permeable to vapor hydrofluoric acid (HF) etchant. The micro-device comprises a Microelectromechanical Systems (MEMS) device with a component that is moveable in operational use of the MEMS device. The component is arranged within the cavity.

CROSS REFERENCE

This application is a divisional of U.S. Ser. No. 13/673,494 filed Nov.9, 2012, and entitled “Method of Manufacturing a Device with a Cavity,”which is a divisional of U.S. Ser. No. 12/427,797 filed Apr. 22, 2009,and entitled, “Method of Manufacturing a Device with a Cavity,” thedisclosures of which are hereby incorporated by reference in theentirety. This application also claims priority to European patentapplication number 08103686.5, filed Apr. 23, 2008, the disclosures ofwhich is incorporated herein by reference.

FIELD OF THE INVENTION

The invention relates to a method of manufacturing a micro-device with acavity. The invention further relates to such micro-device with acavity, and in particular to a MEMS device or a semiconductor device.

BACKGROUND OF THE INVENTION

Various types of micro-devices with a cavity exist. A first class ofsuch micro-devices consists of micro-electromechanical system (MEMS)devices. Such devices generally comprise a moveable element that iscontrolled by electro-static or piezo-electric forces, i.e. a resonatoror moveable electrode. In order to allow the element to be moveable suchelement is preferably arranged within a cavity.

A second class of such micro-devices consists of semiconductor deviceshaving at least one interconnect layer. In order to reduce parasiticcapacitances of this on-chip interconnect a trend towards low-kdielectrics is observed in deep-submicron process technologies. Theultimate goal for the manufacturing of low-k dielectrics is to createon-chip interconnect without dielectric material around it. Air has adielectric constant which is very close to vacuum, i.e. slightlyabove 1. Because of mechanical reasons such technologies are not yetfeasible, but as an intermediate solution technologies have beenreported wherein cavities, also being referred to as air-gaps, arepresent in the interconnect layers.

Various methods of manufacturing micro-devices with a cavity have beenreported. One such method is known from WO2004/105122 A1 and consists ofobtaining a dual damascene structure, applying a diffusion barrier layerdirectly on the planarized surface and performing a lithography step,thus shielding the metal lines underneath the diffusion barrier layer.Optionally, some portions of large dielectric areas between the metallines are also shielded. The exposed diffusion barrier layer portionsand underlying dielectric are etched. A layer of a material that can bedecomposed in volatile components by heating to a temperature oftypically between 150-450° C. is applied, and planarized by etching orCMP. A dielectric layer that is permeable to the decomposition productsis deposited and subsequently the substrate is heated. Then, thedisposable layer decomposes and disappears through the permeabledielectric layer, leaving air gaps behind in between the metal lines andthe large dielectric areas.

A problem with the known method of manufacturing a micro device with acavity is that the method requires, in particular in the step ofdecomposing the sacrificial layer, relatively high temperatures(150-450° C.) which makes the method less compatible withback-end-of-line (BEOL) processing. This decomposing temperature limitsthe processing after deposition. In subsequent processing steps thetemperature must stay below the decomposition temperature. And thedecomposing temperature should also stay below BEOL temperatures. If amaterial is selected with a higher decomposition temperature, i.e. above450° C., then the decomposition is not BEOL compatible any more.

SUMMARY OF THE INVENTION

It is an object of the invention to provide a method of manufacturing amicro-device with a cavity that requires lower temperatures, and that istherefore more BEOL-processing compatible.

The invention is defined by the independent claims. The dependent claimsdefine advantageous embodiments.

In a first aspect, the invention relates to a method of manufacturing amicro-device with a cavity, the micro-device comprising a substrate, themethod comprising steps of:

-   -   providing the substrate having a surface and comprising a        sacrificial oxide region at the surface;    -   covering the sacrificial oxide region with a porous layer being        permeable to a vapor HF etchant, and    -   selectively etching the sacrificial oxide region through the        porous layer using the vapor HF etchant to obtain the cavity.

The effect of the features of the method in accordance with theinvention is that no high temperature steps are needed anymore. Theinventors have realized that some materials are permeable, or may bemade permeable, to vapor HF etchant and the etch products and aresubstantially left intact by that etchant. Vapor HF etching may be doneat relatively low temperatures, i.e. 35° C., leaving a highertemperature budget for other processing steps which may be done inbetween. Also the deposition of the porous layer is done at relativelylow temperatures. This renders the method more compatible with BEOLprocessing wherein temperatures are preferably kept well below 450° C.In the method it is important that a material is selected that is notetched, or substantially left in tact, by vapor-HF and that is porousenough to remove the “sacrificial” oxide underneath the porous layer bythe vapor HF etchant and also permeable for the etch products. Theinventors have realized that this combination of features can be usedfor creating a cavity underneath the porous layer.

The method of the invention may be applied in various very differentapplication areas. By way of a first example, it may be applied in themanufacturing of air-gaps in the interconnect layers of a semiconductordevice, and, by way of a second example, in the manufacture of a MEMSdevice, and in particular in the encapsulation stage thereof.Nevertheless, the method may be applied in various other applicationareas. In those application areas, the inventive concept is the same,namely the forming of a cavity by selectively etching a sacrificialoxide region through a porous layer that is permeable to vapor HFetchant.

In an embodiment of the method in accordance with the invention theporous layer comprises carbon-doped oxide. This material has beenidentified by the inventors as a class of materials that is permeable tovapor HF etchant. Carbon-doped oxides are also being referred to asorgano-silicate glass (OSG).

In an embodiment of the method in accordance with the invention theporous layer comprises non-densified Black-Diamond™ material ornon-densified Aurora™ material. Black Diamond™ is a dielectric materialthat may be bought from Applied Materials Inc. The process flow which isprovided together with Black Diamond™ includes, after the depositionstep, a plasma treatment step in which a plasma is used to seal theporous (dielectric) layer. In the case of Black Diamond™ a Helium plasmais used. During the plasma treatment a thin (i.e. between 20 nm and 30nm) densified layer is formed at the surface of the porous layer. Theinventors have realized that when this step is left out from the processflow a layer is obtained that is fully permeable to vapor HF etchant.Also, in the Black Diamond™ process flow as provided by AppliedMaterials the first step is to provide an O₂ plasma to have a betteradhesion (so before depositing the Black-Diamond layer). This step isalso skipped in the method according to the invention, because thiscreates an oxidized layer underneath the Black Diamond that can causedelamination of this Black Diamond layer during the release etch.Similar to Black Diamond™ also Aurora™ material may be used. Thesematerials have a very similar chemical structure. In the Aurora processflow also a sealing/densification step is performed, which in the methodaccording to the invention can be skipped.

In an embodiment of the method in accordance with the invention thesacrificial oxide region comprises silicon oxide. Silicon oxide providesfor a large etch rate and is compatible with conventional CMOS processtechnologies.

An embodiment of the method in accordance with the invention ischaracterized in that the micro-device comprises a MEMS device with acomponent that is moveable in operational use of the MEMS device, and inthat

-   -   in the step of providing the substrate, the substrate comprises        the MEMS device with an element; the element being embedded        between the sacrificial oxide region at the surface and a        further sacrificial oxide region in contact with the sacrificial        oxide region; and    -   in the step of selectively etching, both the sacrificial oxide        region and the further sacrificial oxide region are selectively        etched for forming the cavity around the element for releasing        the element so as to obtain the component. The method in        accordance with the invention is advantageously applied in the        manufacture of MEMS devices, and in particular in the        encapsulation stage thereof. In this embodiment the lower        temperature of the process in accordance with the invention,        leads to a higher compatibility with BEOL processing. Also, the        method renders the need for etching holes in the porous layer        superfluous (which is done in other known methods). This saves a        masking step and thus costs. An additional advantage in the        manufacture of MEMS device is that the porous layer makes it        much easier to seal the cavity. The porous layer prevents        deposition of sealing material in the cavity (and on the        moveable component).

An embodiment of the method in accordance with the invention the methodis characterized in that:

-   -   between the step of providing the substrate and the step of        covering the sacrificial oxide region, a first step of covering        the substrate with a packaging cap layer for forming an        encapsulation shell for the MEMS device, and a second step of        patterning the packaging cap layer for forming a release hole in        the packaging cap layer extending to the sacrificial oxide        region, and in that    -   in the step of covering the sacrificial region, the porous layer        is also provided so as to cover the release hole, and in that    -   in the step of selectively etching, the etching occurs through        the porous layer which is located in the release hole. This        embodiment of the method looks more like the conventional        method, because it makes use of the packaging cap layer, which        is used in the conventional methods too. The use of the        packaging cap layer provides for a better mechanical        strength/stability of the structure (i.e. the packaging cap        layer is much stronger than the porous layer). The porous layer        may be provided on a wall or on the walls of the release hole or        maybe covering the release hole as a lid.

An embodiment of the method in accordance with the invention comprises,after the step of selectively etching, a sealing step comprising sealingthe porous layer. In certain applications it may be desired to make avacuum in the cavity. If the method is carried out in vacuum until aftersealing the porous layer, the vacuum in the cavity is maintained.

In an embodiment of the method in accordance with the invention thesealing step comprises covering the porous layer with a sealing layer.Providing a sealing layer on the porous layer leads to a structure witha higher mechanical strength and stability. Also, the depositionenvironment will be the environment in the cavity, so if the MEMS deviceneeds a certain vacuum level you have to make sure that the depositionof the seal layer is in vacuum.

In an embodiment of the method in accordance with the invention thesealing layer comprises a material selected from the group comprising:silicon-germanium (SiGe), silicon dioxide (SiO₂), silicon nitride(Si₃N₄), silicon carbide (SiC), aluminum (Al), titanium-nitride (TiN),tantalum (Ta), and all other materials known BEOL deposition processes(CVD/PECVD or PVD layers).

An embodiment of the method in accordance with the invention ischaracterized in that the micro-device comprises a semiconductor devicewith a first interconnect layer, and in that

-   -   in the step of providing the substrate, the substrate comprises        the first interconnect layer, the first interconnect layer        comprising the sacrificial oxide region at the surface, and in        that    -   in the step of selectively etching, the cavity in the first        interconnect layer is obtained for forming an air gap. The        method in accordance with the invention is advantageously        applied in the manufacture of semiconductor devices, and in        particular in the back-end-of-line (BEOL) stage thereof. In this        embodiment the lower temperature of the process in accordance        with the invention, leads to a higher compatibility with BEOL        processing. Also, this embodiment of the method renders the use        of hard mask layers superfluous. Hard mask layers generally have        a higher dielectric constant. Consequently, this embodiment of        the method provides for a semiconductor device having        interconnect with a lower effective dielectric constant, and        thus a lower parasitic capacitance. This will be elaborated on        in more detail in the Figure description. It must be noted that        this embodiment of the method may be combined with the        embodiment in which a MEMS device is manufactured. This is        because the invention provides a method which is BEOL compatible        due to its lower temperatures. The respective cavity for the        MEMS device and the respective cavity for the semiconductor        device may be manufactured simultaneously (using the same        selective etching step) or after each other.

An embodiment of the method in accordance with the invention ischaracterized in that:

-   -   in the step of providing the substrate, the substrate comprises        a second interconnect layer, wherein the second interconnect        layer comprises a second sacrificial oxide layer, wherein first        and the second sacrificial oxide layers are separated by a        second porous layer being permeable to a vapor HF etchant, and        in that    -   in the step of selectively etching, the first cavity in the        first interconnect layer and a second cavity in the second        interconnect layer are obtained for forming airgaps. This method        results in a semiconductor device having multiple interconnect        layers, which provides for more routing resources and higher        packing densities. The advantages of the method in accordance        with the invention are significant. First of all, all airgaps        are formed in the last BEOL step, which ensures a higher        structural integrity during back-end processing. Furthermore,        the airgaps are formed in a single etch step which reduces the        number of processing steps.

In a second aspect the invention relates to micro-device, manufacturedwith a method comprising photolithographic processing, comprising asubstrate with a cavity, wherein the cavity is covered with a porouslayer that is permeable to vapor HF etchant. The advantages of themicro-device and its embodiments follow that of the corresponding methodof manufacturing.

In a first main group of embodiments of the micro-device in accordancewith the invention, the micro-device comprises a MEMS device with acomponent that is moveable in operational use of the MEMS device,wherein the component is arranged within the cavity.

An embodiment of the micro-device in accordance with the inventionfurther comprises a patterned packaging cap layer with a release holeextending to the cavity the porous layer has been provided on thepackaging cap layer and in the release hole.

In this embodiment the porous layer closes the cavity (together with thepatterned packaging cap layer.

In an embodiment of the micro-device in accordance with the inventionthe porous layer has been sealed.

In an embodiment of the micro-device in accordance with the inventionthe porous layer has been covered with a sealing layer.

In an embodiment of the micro-device in accordance with the inventionthe sealing layer comprises a material selected from the groupcomprising: silicon-germanium (SiGe), silicon dioxide (SiO₂), siliconnitride (Si₃N₄), silicon carbide (SiC), aluminum (Al), titanium-nitride(TiN), tantalum (Ta), and all other materials known BEOL depositionprocesses (CVD/PECVD or PVD layers).

In a second main group of embodiments of the micro-device in accordancewith the invention, the micro-device comprises a semiconductor devicewith a first interconnect layer, wherein the first interconnect layercomprises the cavity for reducing parasitic interconnect capacitance,the cavity being covered by the porous layer being permeable to vapor HFetchant.

In an embodiment of the micro-device in accordance with the inventionthe cavity is provided at a trench level of the interconnect layer. Inanother embodiment of the micro-device in accordance with the inventionthe cavity is provided at a via-level of the interconnect layer. In anycase, the cavity is located there were the sacrificial oxide region waslocated.

In an embodiment of the micro-device in accordance with the invention asecond interconnect layer, wherein the first interconnect layer and thesecond interconnect layer are separated by a further porous layer beingpermeable to vapor HF etchant.

These and other aspects of the invention are apparent from and will beelucidated with reference to the embodiments described hereinafter.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings:

FIGS. 1a to 1e schematically show an encapsulation process of a MEMSdevice as known from the prior art;

FIGS. 2a to 2f schematically show an encapsulation process of a MEMSdevice in accordance with a first embodiment of the method of theinvention;

FIGS. 3a to 3e schematically show an encapsulation process of a MEMSdevice in accordance with a second embodiment of the method of theinvention;

FIGS. 4a 1 and 4 a 2 schematically show an etching step carried outbetween two process stages of a first experiment proving the feasibilityof the first embodiment of the method of the invention;

FIG. 4b shows a cross-section SEM picture of the device of FIG. 4a 2;

FIGS. 5a 1 and 5 a 2 schematically show a sealing step carried outbetween further process stages of the first experiment proving thefeasibility of the first embodiment of the method of the invention;

FIG. 5b shows a cross-section SEM picture of the device of FIG. 5a 2;

FIGS. 6a 1 and 6 a 2 schematically show an etching step carried outbetween two process stages of a first experiment proving the feasibilityof the second embodiment of the method of the invention;

FIGS. 6b to 6d show cross-section SEM pictures of devices in accordancewith FIG. 6a 2 for different porous layer thicknesses, and

FIGS. 7a to 7j show different stages in a method of manufacturing asemiconductor device in accordance with a third embodiment of the methodof the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The invention relates to the manufacturing of a micro-device with acavity, and to such a micro-device itself. The description focuses ontwo application areas, MEMS devices and semiconductor devices. In MEMSdevices the cavity is situated around a moveable element, and has thefunction of allowing the moveable component to move in operation. Insemiconductor devices, cavities are situated near interconnect in orderto reduce parasitic capacitances. In this application area cavities inthe interconnect layers are also being referred to as air-gaps.

Throughout this description the term “interconnect layer” should beconsidered as synonym to “metallization layer” or “metal layer”. Bothterms are used interchangeably and have to be interpreted as the layercomprising conductors, the insulating layer in which the conductors areembedded, and any vias (=contacts) to underlying layers. These terms arewell-known to the person skilled in the art of semiconductor technology.

Throughout this description the term substrate should be interpretedbroadly. The substrate may comprise at its front-side elements, e.g.transistors, capacitors, resistors, diodes, and inductors, which formthe components of an electronic circuit. The substrate may furthercomprise interconnections between the elements which may be laid out inone or more interconnect layers. In the Figures, the elements have beenleft out in order to facilitate the understanding of the invention.

Where in this description the word “MEMS” (micro-electromechanicalsystems) is used, this should also be construed to include NEMS(nano-electromechanical systems). Wherein this description the worddeep-submicron process technology is used, this should also be construedto include nanotechnology.

In this description in semiconductor devices different dielectric layersare mentioned. A first dielectric is located between interconnects inthe same interconnect layer. This dielectric is also called intra-metaldielectric (IMD) or trench-level dielectric. A second dielectric islocated between interconnects in different interconnect layers, which isalso called inter-layer dielectric (ILD) or via-level dielectric.

In this description reference is made to a process step called vapor HFetching. This technique is considered as known to the person skilled inthe art. More information can be found in various disclosures, forexample in:

-   C. R. Helms, and B. E. Deal, “Mechanisms of the HF/H ₂ O vapor phase    etching of SiO ₂”, J. Vac. Sci. Technol. A 10(4), July/August 1992.

A MEMS device has to be protected during dicing and molding. One methodto do this is by wafer level packaging. This means that standard micromachined techniques for the encapsulation of the MEMS device are beingused. A big advance of this technique over others is the costaffectivity and the small device footprint. FIGS. 1a to 1e schematicallyshow an encapsulation process of a MEMS device as known from the priorart.

In the step of FIG. 1a a substantially completed MEMS device (forexample a resonator) is provided. The MEMS device comprises a body 10which comprises a substrate 5, a buried sacrificial oxide layer 8provided on the substrate 5, and a device layer 15 in which an element18 has been formed which, when in operational use, must be moveable. Theelement 18 has been defined in the device layer 15 by means of trenches19 which expose the underlying buried sacrificial oxide layer 8. Atcertain locations the trenches are interrupted in order to defineanchors to the element 18. These anchors (not shown) have the functionas resilient springs for suspending the element 18 in the body 10.

The substrate 5 may be of any kind, including semiconductor substratesand the buried oxide layer 8 may be silicon oxide for example. Also, thesubstrate 5 may comprise active devices like transistors and diodes (notshown). The device layer 15 may comprise semiconductor material, andalso other elements (left out for clarity reasons).

In the step of FIG. 1b a further sacrificial oxide layer 20 is providedsuch that it covers the element 18 and fills the trenches 19. The stepmay be done by fully covering the MEMS device with the sacrificial oxidelayer 20 and then patterning the layer 20 using conventionallithographic processing. The further sacrificial oxide layer 20 may besilicon oxide for example. Whereas, in this embodiment the trenches arefilled with the further sacrificial oxide layer this is not necessary,as long as they are not filled with material that would not be etchedaway with vapor HF etchant.

In the step of FIG. 1c , a packaging cap layer 30 is deposited on theMEMS device for the formation of the encapsulation shell of the device,and subsequently the layer 30 is patterned to form release holes 31 thatextend to the underlying further sacrificial oxide layer 20. Thepackaging cap layer may comprise materials like: SiC, Si₃N₄ SiGe, andPoly-Si (not SiO₂). Patterning of the packaging cap layer 30 may be doneby means of patterning (lithography followed by etching) which is wellknown to the person skilled in the art.

In the step of FIG. 1d , both the buried sacrificial oxide layer 8 andthe further sacrificial oxide layer 20 are selectively removed byselective etching using an etching chemistry 90, for example a liquidhydrogen-fluoride (HF) solution or a vapor HF etchant in case siliconoxide is used as sacrificial material.

Selective etching is a technique which is well known to the personskilled in the art. During the selective etching step, which takes placethrough the release holes 31, the sacrificial oxide material is removedwhich leaves a cavity 50 around the element 18 releasing the mechanicalmicro structure. Expressed differently, the element 18 now becomes amoveable component. In the Figure it seems as if the component 18 isfloating, but in practice there are anchors (not shown) keeping thecomponent in place. Preferably, the buried sacrificial oxide layer 8 andthe sacrificial oxide layer 20 are of the same material, which makes iteasier to remove both layers in the same etching step.

In the step of FIG. 1e the release holes 31 are sealed by depositing aseal layer 60. The seal layer 60 may comprise materials like:silicon-germanium (SiGe), silicon dioxide (SiO₂), silicon nitride(Si₃N₄), silicon carbide (SiC), aluminum (Al), titanium-nitride (TiN),tantalum (Ta), and all other materials known BEOL deposition processes(CVD/PECVD or PVD layers). There is a very important design constraintin the encapsulation method of MEMS devices of this kind. The mostdifficult step in the wafer encapsulation process is the sealing of thereleasing holes. The resonator/MEMS device is sensitive for impurities,so the seal layer 60 has to be deposited without leaving impuritiesinside. The release holes 31 may not be too large and may not be locatedabove the moveable component 18, because otherwise material from theseal layer 60 may fall onto the moveable component 18 which isdetrimental for the performance of the device. If a vacuum is neededwithin the cavity the deposition pressure must be low enough.

The inventors have realized that back-end of line (BEOL) compatibleprocess-temperatures (below 450° C.) would be a big asset for thismethod. This has as advantage that the resonator can be integrated witha CMOS-device on one chip and that the encapsulation of the resonatorcan be the last step and will not interfere with the CMOS processing.Both problems will be overcome by using a the method in accordance withthe invention as illustrated in FIGS. 2a to 2 f.

FIGS. 2a to 2f schematically show an encapsulation process of a MEMSdevice in accordance with a first embodiment of the method of theinvention. This process will be discussed in as far as it differs fromthe known process illustrated in FIGS. 1a to 1e . The first two steps(FIGS. 2a and 2b ) are the same as the first two steps of the knownprocess. The third step, illustrated in FIG. 2c differs from the thirdstep of the known method in that the release holes 31′ in the packagingcap layer 30 may be designed much larger and may also be located abovethe moveable component 18. In the step of FIG. 2a , if the sacrificialoxide layer 8 is not an oxide it has to be removed before thesacrificial oxide layer 20 is deposited, because it will have to beremoved together with the sacrificial oxide layer 20.

The step of FIG. 2d is new. In this step a porous layer 40 is depositedon the packaging cap layer 30 and in the release holes. The inventorshave discovered that the material of the porous layer 40 may be selectedsuch that the layer 40 is permeable to vapor HF etchant. Carbon-dopedoxides are known to have this property, but there may be more classes.Within the carbon-doped oxide group the inventors have discovered thatboth non-densified Black-Diamond™ material (BD) or non-densified Aurora™material (AU) may be used. It must be noted that the process flows whichare provided by the manufacturers of these materials do notautomatically lead to material being permeable to vapor HF etchant.Earlier in this description it has already been described that plasmatreatments must be skipped. The deposition of the native materials isenough. If the last treatment (He-plasma) is done the accomplisheddensified layer will be removed by vapor-HF.

The step of FIG. 2e differs from the step in FIG. 1d in that instead ofliquid HF etchant, vapor HF etchant 100 is used. Vapor HF etching assuch is known to the person skilled in the art. Nevertheless, theinventive idea of the invention is to use vapor HF etchant 100 toselectively remove a sacrificial oxide layer through a porous layer thatis permeable to vapor HF etchant 100.

The step of FIG. 1f differs from the step in FIG. 1e in that the sealinglayer 60 is now provided on the porous layer 40. It is optional toprovide a plasma treatment before deposition of the sealing layer 60.

The main advantages of the method of FIG. 2 are:

-   -   The BD material or AU material may be deposited with a back-end        compatible temperature (i.e. 350° C. for BD), and    -   The porous layer 40 “pre-seals” the releasing hole 31′ before        the sacrificial layers 20, 8 are removed. Both BD and AU are        porous enough to enable removal of the sacrificial oxide layer        (with vapor HF etchant 100) but still avoid the deposition of        seal-layer impurities inside the cavity. Another advantage of        the BD and AU are insulators and therefore do not electrically        interfere with the MEMS device (resonator). A further        improvement may be obtained if a plasma treatment is performed        before the sealing layer is provided. If the product gasses used        during the deposition of the sealing layer are small enough to        travel through the Black Diamond™ or Aurora™ layer, the top of        the Black Diamond™ layer may be densified by a plasma (for        example a Helium plasma) prior to the deposition of the sealing        layer.

FIGS. 3a to 3e schematically show an encapsulation process of a MEMSdevice in accordance with a second embodiment of the method of theinvention. This process will be discussed in as far as it differs fromthe first embodiment of the method in accordance with the invention asillustrated in FIGS. 2a to 2f . As a matter of fact the differencebetween the first embodiment and the second embodiment is that the stepof providing a patterned packaging cap layer 30 (FIG. 2) with releaseholes 31 (FIG. 2) is completely omitted. Instead in FIG. 3c the porouslayer 40 is provided (deposited) directly on the further sacrificialoxide layer 20. In order to ensure mechanical stability the porous layer40 may need to be thicker than in the first embodiment of the method.However, thicker layers, while being mechanically stronger, may alsohave more internal stress. With the method as illustrated in FIGS. 2a to2f it may be easier to choose for the packaging cap layer a materialwhich is strong and has less stress. Contrary to other known methodsreported in the prior art, there is no need to create holes forselectively etching the sacrificial oxide layer. Moreover, no packagingcap layer material is needed. Both aspects make the method of FIG. 3need less process steps and in particular less masking steps. Cheaperdevices may be manufactured.

In both the first embodiment (FIG. 2) and the second embodiment (FIG. 3)of the method in accordance with the invention, the last sealing stepmay be done by performing a plasma treatment. Such a plasma treatmentdensifies and seals the material at the surface of the porous layer 40.

FIGS. 4a 1 and 4 a 2 schematically show an etching step carried outbetween two process stages of a first experiment proving the feasibilityof the first embodiment of the method of the invention. FIG. 4b shows across-section SEM picture of the device of FIG. 4a 2.

In the step of FIG. 4a 1 a substrate 10 is provided having a sacrificialoxide region 20 provided thereon. The sacrificial oxide region 20, heresilicon oxide, is covered with a packaging cap layer 30 with releaseholes 35. A porous layer 40, here BD material, which is permeable tovapor HF etchant, is provided on the packaging cap layer 30 and in therelease holes 35. In FIG. 4a 2 the vapor HF etch (30 minutes at 35° C.)is carried out removing the sacrificial oxide region 20 and creating acavity 50. The cross-section SEM picture of FIG. 4b shows clearly thatall oxide in the cavity 50 is removed.

FIGS. 5a 1 and 5 a 2 schematically show a sealing step carried outbetween further process stages of the first experiment proving thefeasibility of the first embodiment of the method of the invention. FIG.5b shows a cross-section SEM picture of the device of FIG. 5a 2. FIG. 5a1 is the same as FIG. 4a 2. FIG. 5a 2 illustrates a further step of theexperiment in which a seal layer (here silicon-germanium (SiGe)) isdeposited on the porous layer 40. A schematic drawing of this experimentand a X-section SEM picture of the result is shown in FIG. 5. Clearly,there has been no deposition of the sealing layer 60 into the cavity 50.

FIGS. 6a 1 and 6 a 2 schematically show an etching step carried outbetween two process stages of a first experiment proving the feasibilityof the second embodiment of the method of the invention. FIGS. 6b to 6dshow cross-section SEM pictures of devices in accordance with FIG. 6a 2for different porous layer thicknesses, 700 nm, 500 nm, and 300 nm,respectively. In FIG. 6a 1 the porous layer 30 is directly used aspackaging cap layer. The most important result of this second experimentis that even a 700 nm thick BD layer was porous enough to remove thesacrificial (oxide) layer 20 as is visible in FIG. 6b . The BD layermust be chosen thick enough to withstand the deposition of a sealinglayer 60 (FIG. 5), which also depends on the sealing requirements.

FIGS. 7a to 7j show different stages in a method of manufacturing asemiconductor device in accordance with a third embodiment of the methodof the invention.

In the step of FIG. 7a a substrate 110 is provided comprising asemiconductor body 105. The semiconductor body 105 may comprise any oneof the following semiconductor materials and compositions like silicon(Si), germanium (Ge), silicon germanium (SiGe), gallium-arsenide (GaAs)and other III-V compounds like indium-phosphide (InP), cadmium sulfide(CdS) and other II-VI compounds, or combinations of these materials andcompositions. The semiconductor body may comprise active elements liketransistors and diodes (not shown). These active elements together mayform an electronic circuit (not shown). In any case, connection of theactive elements is done via interconnect layers. These interconnectlayers have parasitic capacitances which are defined by the dielectricconstant of surrounding materials. The semiconductor body may evencomprises contacts to lower layers (e.g. diffusion regions at thesurface of an active region).

On the semiconductor body 105 a bottom barrier layer 106 is provided,and on the bottom barrier layer 106 an oxide layer 107 is provided, forexample silicon oxide. A patterned masking layer 108 is provided on theoxide layer 107. The masking layer may be a hardmask or a photoresistlayer, but here it is a photoresist layer. Masking is part ofconventional lithography and well known to the person skilled in theart. The pattern in the masking layer 108 defines the locations wherethe interconnecting wires will be formed.

In the step of FIG. 7b trenches 109 are etched in the oxide layer 107.Subsequently, the photoresist layer is stripped, and the bottom barrierlayer 106 is opened such that the semiconductor body 105 having activeelements is exposed.

In the step of FIG. 7c first layer metallization is provided in thetrenches 109. The metallization, i.e. interconnect lines, in thisembodiment comprises copper, which may be provided as follows. First, abarrier layer is provided in the trenches. Then, a copper seed is layeris provided on the bottom of the trenches. Subsequently, bulk copper isdeposited by copper electroplating, and finally a CMP step is performed.

In the step of FIG. 7d a passivation layer (self-aligned barrier) 113 isdeposited on top of the copper interconnect lines by means ofelectroless barrier deposition. The barrier materials may comprisecompositions like cobalt-tungsten-phosphor (CoWP), cobalt-tungsten-boron(CoWB). Alternatively, the passivation layer 113 may be provided using acombination of etching, deposition, and CMP, wherein the layer 113comprises tantalum (Ta), titanium nitride (TiN), tantalum nitride (TaN),or combinations of those materials.

In the step of FIG. 7e a porous layer 114, in this exampleBlack-Diamond™, is deposited using CVD processing on the structure. Asalready mentioned, no barrier layers or thin oxide layers are needed,and also no plasma treatment of the deposited Black-Diamond™ layer 114should be done. Consequently, the porous layer 114 is permeable to vaporHF etchant, which a requirement of the invention, at least if furtherlayers have to be deposited on the porous layer 114 as is the case inthis process flow. In the step of FIG. 7e , also a further oxide layer115 is provided on the porous layer 114. Subsequently, on the furtheroxide layer 115, a patterned via masking layer 116, here a photo resistlayer, is provided, the photoresist layer 116 having small openings 117for defining dimensions of the vias to be formed.

In the step of FIG. 7f , first, via openings 118 are etching using thepatterned via masking layer 116 as a mask. The via openings 118 areetched to till approximately half way the full dielectric stack abovethe copper lines. Then, the photoresist layer 116 is stripped, and apatterned metallization masking layer 119, here a photoresist layer, isprovided on the further oxide layer 115. The photoresist layer 119 haswider trenches 120 for defining dimensions of the interconnect lines tobe formed in the second metallization layer.

In the step of FIG. 7g , a further etch step is performed using thepatterned metallization masking layer 119 as a mask. By doing so thetrenches 120 for the interconnect lines to be formed are deepened, andalso the via openings 118 for the vias are deepened such that theyextend to the capping layer 113 of the lower interconnect layer.Subsequently, the photoresist layer 119 is stripped followed by anoptional cleaning step (e.g. using diluted HF and/or a sputter clean).

In the step of FIG. 7h second layer metallization is provided in thetrenches 120 and the openings 118. The metallization, i.e. interconnectlines and vias, in this embodiment comprises copper, which may beprovided as follows. First, a barrier layer is provided in the trenchesand the openings. Then, a copper seed is layer is provided on the bottomof the trenches and openings. Subsequently, bulk copper is deposited bycopper electroplating, and finally a CMP step is performed.

In the step of FIG. 7i a passivation layer (self-aligned barrier) 123 isdeposited on top of the copper interconnect lines by means ofelectroless barrier deposition. The barrier materials may comprisecompositions like cobalt-tungsten-phosphor (CoWP), cobalt-tungsten-boron(CoWB). Then, a further porous layer 124, in this exampleBlack-Diamond™, is deposited using CVD processing on the furtherdielectric layer 115 and the copper lines 122. As already mentioned, nobarrier layers or thin oxide layers are needed in the Black-Diamond™layer 124, and also no plasma treatment of the deposited Black-Diamond™layer 114 should be done. Consequently, the further porous layer 124 ispermeable to vapor HF etchant, which is a requirement of the invention.

In the step of FIG. 7j a vapor HF etch step is performed using vapor HFetchant 100. In this etch step the vapor HF etchant 100 penetrates thepermeable further porous layer 124, selectively removes the furtheroxide layer 115, penetrates the permeable porous layer 114, andselectively removed the oxide layer 115. This step leaves cavities 50 inboth the first as well as the second interconnect layer at the trenchlevel/intra-metal dielectric level. These cavities 50 are also calledair-gaps in literature.

The method and device in accordance with the invention provide foranother advantage over known methods and devices. In the method inaccordance with the invention no hard-masks are required on top of thesacrificial layers 107, 115. Consequently, the height h of the air-gapsis larger. This leads to a reduced effective dielectric constant of thecopper lines, which leads to lower parasitic capacitances.

In FIGS. 7a to 7j a method of manufacturing a semiconductor device withtwo interconnect layers. It must be noted, however, that any number ofinterconnect layers may be chosen. Such, modification only requires arepetition of process steps, before the step of vapor HF etching isdone. In case of only a single interconnect layer it is no longerrequired not to densify the porous layer as the vapor HF etchant willremove the densified layer anyhow. In case of a plurality ofinterconnect layers this is different. When the lower interconnectlayers have a thin densified layer at their surface, the vapor HFetchant will remove these layers, but this will make the layers in themetal stack loose from each other, which is also called delamination.

The description of FIGS. 7a to 7j showed the steps involved to make aMulti-Level (Dual) Damascene Copper Interconnect having Air Gaps atevery trench level to reduce capacitance and thus RC-delay. The methodof manufacturing a micro-device with a cavity in accordance with theinvention is especially useful because the final air-gaps are made onlyafter all relevant BEOL processing steps have been done. This ensuresnot only RC-delay reduction, but also ensures optimal structuralstability trough-out the entire Multi-Level Interconnect processingwhich can include up to more than 10 levels in future IC's.

It must be noted that in the process flow as illustrated in FIGS. 7a to7j the number of Air Gap levels can be chosen according to the needs ofthe designer. Only there where sacrificial oxide is deposited an air-gapwill be formed. In other words, the capacitance reduction may be tunedat desired metal levels and via levels.

It must be stressed that the method as illustrated in FIGS. 7a to 7j arejust an example embodiment. In back-end-of-line processes ofdeep-submicron technologies many variations exist. For example, aluminuminterconnect versus copper interconnect, single damascene copper versusdual damascene copper, various types of barriers layers or no barrierlayer, capping layers or no capping layers, various types ofdielectrics, and so on. It must be noted that these variations do notaffect the applicability of the method of the invention. Where anair-gap is desired a sacrificial oxide 20 layer may be deposited andcovered by a porous layer 40 that is permeable to vapor HF etchant 100.As long as there is “path” from the top surface of the device throughporous layers 40, air-gaps 50 to the air-gaps in the lowest interconnectlayer, the method in accordance with the invention may be applied. Ifthe sacrificial oxide regions in all air-gaps are selected such thatthey are removed by vapor HF-etchant, then all air-gaps will be createdin the same etchant step.

The invention may be applied in a wide variety of application areas. Byway of a first example illustrated in this description, it may beapplied in the manufacturing of air-gaps in the interconnect layers of asemiconductor device, and, by way of a second example illustrated inthis description, in the manufacture of a MEMS device, and in particularin the encapsulation stage thereof. Nevertheless, the method may beapplied in various other application areas. In those application areas,the inventive concept is the same, namely the forming of a cavity byselectively etching a sacrificial oxide region through a porous layerthat is permeable to vapor HF etchant.

The description so far did not go into detail about the various types ofMEMS device which may be encapsulated using the method of the invention.The method is broadly applicable to various types of micro-device,including MEMS devices. The only requirement for MEMS device is that theMEMS device comprises a moveable component which is located in a cavity.In one embodiment of the micro-device in accordance with the inventionthe MEMS device is a MEMS resonator. In such device the moveablecomponent is a membrane which is mechanically coupled to a substratewith so-called anchors and which may be brought into resonating mode bymeans of, for example, electrostatic forces. A MEMS resonator may beapplied in various application areas, for example it may be used tosubstitute crystal oscillators (XO's) for timing reference purposes.Also, they may form part of phase-locked loops. Phase-locked loops maybe used in high-frequency clock generators.

Various variations of the method and micro-device in accordance with theinvention are possible and do not depart from the scope of the inventionas claimed. These variations for example relate to the manufacturing ofother micro-devices which have not been explicitly mentioned in thisdescription. Also, in the method of manufacturing a micro-device inaccordance with an embodiment of the method of the invention, manyalterations are possible. Such alterations fall within the normalroutine of the person skilled in the art and do not deviate from theinventive concept here disclosed.

It should be noted that the above-mentioned embodiments illustraterather than limit the invention, and that those skilled in the art willbe able to design many alternative embodiments without departing fromthe scope of the appended claims. In the claims, any reference signsplaced between parentheses shall not be construed as limiting the claim.Use of the verb “comprise” and its conjugations does not exclude thepresence of elements or steps other than those stated in a claim. Thearticle “a” or “an” preceding an element does not exclude the presenceof a plurality of such elements. The invention may be implemented bymeans of hardware comprising several distinct elements, and by means ofa suitably programmed computer. In the device claim enumerating severalmeans, several of these means may be embodied by one and the same itemof hardware. The mere fact that certain measures are recited in mutuallydifferent dependent claims does not indicate that a combination of thesemeasures cannot be used to advantage. Throughout the Figures, similar orcorresponding features are indicated by same reference numerals orlabels.

The invention claimed is:
 1. A micro-device, comprising a substrate witha cavity, wherein the cavity is covered with a patterned cap layer, thepatterned cap layer being covered with a porous layer that is permeableto vapor hydrofluoric acid (HF) etchant, wherein a top surface of theporous layer is at a first level over features of the patterned caplayer and at a second level between the features, the second level beingdifferent than the first level, wherein the micro-device comprises aMicroelectromechanical Systems (MEMS) device with a component that ismoveable in operational use of the MEMS device, wherein the component isarranged within the cavity, wherein the porous layer comprises anon-densified carbon doped oxide.
 2. The micro-device of claim 1,further comprising a release hole extending to the cavity through thecap layer, wherein the porous layer is provided on the cap layer and inthe release hole.
 3. The micro-device of claim 1, further comprising asealing layer deposited over the porous layer.
 4. The micro-device ofclaim 1, wherein the cavity comprises an air gap in a sacrificial oxideregion.
 5. The micro-device of claim 4, wherein the sacrificial oxideregion comprises silicon oxide.
 6. The micro-device of claim 1, whereinthe porous layer has a thickness less than 700 nm.
 7. A micro-devicecomprising: a substrate comprising an element that is moveable inoperational use of a Microelectromechanical Systems (MEMS) device, theelement being positioned within a cavity; a packaging cap layerincluding a hole aligned with the cavity; and a porous layer comprisinga porous material, the porous layer covering the cavity such that a topsurface of the porous layer is at a first level within the hole and adifferent level over the packaging cap layer, the porous material beingpermeable to a vapor hydrofluoric acid (HF) etchant; wherein the porouslayer comprises a non-densified carbon doped oxide.
 8. The device ofclaim 7, further comprising a release hole in the packaging cap layerover the porous layer.
 9. The device of claim 8, wherein the packagingcap layer includes the release hole directly above the element.
 10. Thedevice of claim 8, further comprising, a sealing layer over the porouslayer.
 11. The device of claim 8, wherein the porous layer has athickness less than 700 nm.
 12. The device of claim 8, wherein thecavity comprises an air gap in a sacrificial oxide region.
 13. Amicro-device comprising: a substrate; a first interconnect layer; afirst porous layer being permeable to a vapor hydrofluroic acid (HF)etchant, the porous layer being disposed over the first interconnectlayer, the first interconnect layer and the first porous layer define afirst cavity; a second interconnect layer disposed over the firstinterconnect layer; a second porous layer disposed over the secondinterconnect layer, wherein the second porous layer is permeable to avapor HF etchant, the second interconnect layer and the second porouslayer defining a second cavity wherein the first and second porouslayers comprise a non-densified carbon-doped oxide; and aMicroelectromechanical System (MEMS) device disposed within the firstand second cavities.
 14. The device of claim 13, further comprising, asealing layer over the first porous layer.
 15. The device of claim 13,wherein the first porous layer has a thickness less than 700 nm.
 16. Thedevice of claim 13, wherein the first cavity comprises an air gap in asacrificial oxide region.
 17. The device of claim 13, further comprisinga patterned packaging cap layer with a release hole extending to thecavity.
 18. The device of claim 17, wherein the porous layer is providedon the packaging cap layer and in the release hole.
 19. The device ofclaim 13, wherein the micro-device does not include a packaging caplayer between the porous layer and the cavity.